Description
High and low temperature resistant multipurpose hotmelt adhesive.
TECBOND 7784 is a tough flexible polyamide based adhesive that exhibits excellent adhesion to many difficult to bond substrates. Suitable for
product assembly, woodworking, and packaging applications that require both high and low heat resistance.
TECBOND 7784 is a tough flexible polyamide based adhesive that exhibits excellent adhesion to many difficult to bond substrates. Suitable for
product assembly, woodworking, and packaging applications that require both high and low heat resistance.
